Process Capacity
Items
Mass production capabilities
Prototyping capabilities
Layers
1-20
1-28
Base materals
FR-4, High-frequency
Max. Board Size
1200mm×620mm
1200mm×620mm
Dimension accuracy
±0.13mm
±0.1mm
Thickness range
0.20-4.00mm
0.20-6.00mm
Thickness tolerance
(THK<0.8mm)
±10%
±10%
Thickness tolerance
(THK≥
0.8mm)
±8%
±8%
Dielectric thickness
0.07-3.20mm
0.07-5.00mm
Min. trace width
0.1mm
0.075mm
Min. trace spacing
0.1mm
0.075mm
Outer copper weight
37-175um
35-280um
Inner copper weight
17-175um
17-280um
Drill hole
(Mechanical)
(Mechanical)
0.15-6.35mm
0.15-6.35mm
Finished hole
(Mechanical)
(Mechanical)
0.10-6.30mm
0.10-6.30mm
Diameter tolerance
(Mechanical)
(Mechanical)
±0.075mm
±0.075mm
Hole position tolerance
(Mechanical)
(Mechanical)
±0.05mm
±0.05mm
Aspect ratio
22:1
22:1
Solder mask type
LPI
LPI
Minimum solder mask bridge width
0.1mm
0.08mm
Minimum solder mask clearance
0.075mm
0.05mm
Plug hole diameter
0.25-0.50mm
0.25-0.60mm
Impedance control tolerance
±10%
±10%
Surface finish
HASL, LF-HASL, ENIG, Imm Tin , OSP, Imm Gold Finger