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4 Layer ENIG Blind Buried Via PCB2021-08-06T03:21:04+00:00

4 Layer ENIG Blind Buried Via PCB

Number of layers: 4
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 6/4mil
Inner layer W/S: 6/5mil
Thickness:1.6mm
Min. hole diameter: 0.3mm
Special process: Blind & Buried Vias Impedance Control

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