4 Layer ENIG Blind Buried Via PCB
Number of layers: 4
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 6/4mil
Inner layer W/S: 6/5mil
Thickness:1.6mm
Min. hole diameter: 0.3mm
Special process: Blind & Buried Vias Impedance Control
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 6/4mil
Inner layer W/S: 6/5mil
Thickness:1.6mm
Min. hole diameter: 0.3mm
Special process: Blind & Buried Vias Impedance Control
Advantages Of 4 Layer ENIG Blind Buried Via PCB
- Own lamination process to convenient production for Multilayer PCB and shorten the lead time.
- Jiangxi facility is environmental-friendly approved by the government .
- Famous raw materials brand, Kingboard, Shengyi, ITEQ, Taiyo, Guangxin.
- Highly automated production line with AIO Optical Scanning, Electroplating Automatic Line, High-speed flying probe test machines and inkjet printer.
- Engineers with more than 15 years of experience
- Quick turn, prototype, medium or large batches can be produced to meet the needs of different customers.
- High staff stability, low mobility.
- UL/ISO9001/SGS/IATF16949/ROHS/ISO1400 certificated.
- Sales office in Shenzhen and own 12,000sqm factory in Jiangxi.
- Establish an e-commerce system to reduce transaction costs and increase market response speed.
Packing And Delivery Of 4 Layer ENIG Blind Buried Via PCB
HUIHE CIRCUITS Provides PCB Assembly & Manufacturing Service
Related PCB Board
Contact Us
- +86 135 3751 8062
- Building 2, Xinda Industrial Park, Luyuan Avenue, Xinfeng County, Ganzhou City, Jiangxi Province