6 Layer ENIG Via-In-Pad PCB production2021-08-06T03:34:56+00:00

6 Layer ENIG via-in-pad PCB production

Number of layers: 6
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 4/3.5mil
Inner layer W/S: 4/3.5mil
Thickness: 2.0mm
Min. hole diameter:0.25mm
Special process: via-in-pad Impedance Control

Advantages Of 6 Layer ENIG via-in-pad PCB production

Packing And Delivery Of 6 Layer ENIG via-in-pad PCB production

HUIHE CIRCUITS Provides PCB Assembly & Manufacturing Service

    Contact Us