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6 Layer ENIG Via-In-Pad PCB production2021-08-06T03:34:56+00:00

6 Layer ENIG via-in-pad PCB production

Number of layers: 6
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 4/3.5mil
Inner layer W/S: 4/3.5mil
Thickness: 2.0mm
Min. hole diameter:0.25mm
Special process: via-in-pad Impedance Control

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