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8 Layer ENIG Blind Buried Via Printed Circuit Board Manufacturers2021-08-06T03:25:36+00:00

8 Layer ENIG Blind Buried Via printed circuit board manufacturers

Number of layers: 8
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 3/3mil
Inner layer W/S: 3/3mil
Thickness: 0.8mm
Min. hole diameter: 0.1mm
Special process: Blind & Buried Vias

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