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8 Layer ENIG Blind Buried Via PCB2021-08-06T03:26:37+00:00

8 Layer ENIG Blind Buried Via PCB

Number of layers: 8
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 4.5/3.5mil
Inner layer W/S: 4.5/3.5mil
Thickness: 1.6mm
Min. hole diameter: 0.25mm
Special process: Blind & Buried Vias Impedance Control

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