8 Layer ENIG Blind Buried Via PCB
Number of layers: 8
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 4.5/3.5mil
Inner layer W/S: 4.5/3.5mil
Thickness: 1.6mm
Min. hole diameter: 0.25mm
Special process: Blind & Buried Vias Impedance Control
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 4.5/3.5mil
Inner layer W/S: 4.5/3.5mil
Thickness: 1.6mm
Min. hole diameter: 0.25mm
Special process: Blind & Buried Vias Impedance Control
Advantages Of 8 Layer ENIG Blind Buried Via PCB
- Own lamination process to convenient production for Multilayer PCB and shorten the lead time.
- Jiangxi facility is environmental-friendly approved by the government .
- Famous raw materials brand, Kingboard, Shengyi, ITEQ, Taiyo, Guangxin.
- Highly automated production line with AIO Optical Scanning, Electroplating Automatic Line, High-speed flying probe test machines and inkjet printer.
- Quick response to quotes.
- The management level is highly educated, 30% have professional titles and more than ten years of work experience.
- High staff stability, low mobility.
- UL/ISO9001/SGS/IATF16949/ROHS/ISO1400 certificated.
- Sales office in Shenzhen and own 12,000sqm factory in Jiangxi.
- Establish an e-commerce system to reduce transaction costs and increase market response speed.
Packing And Delivery Of 8 Layer ENIG Blind Buried Via PCB
HUIHE CIRCUITS Provides PCB Assembly & Manufacturing Service
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