Production & inspection

/Production & inspection
Production & inspection2021-08-06T07:16:47+00:00

Production and inspection process

01.Open material

Cut large sheets into small sheets of various specifications

02.Inner graphics

Form the inner layer circuit pattern on the copper foil of the board

03.Inner AOI inspection

Detect whether the circuit board has open circuit or short circuit defects

04.Browning

Perform copper surface treatment on the production board to generate an oxide layer on the surface of the inner copper foil to improve the bonding force between the copper foil and the epoxy resin when the multilayer circuit board is pressed

05.laminated

The copper foil, PP sheet and the inner layer circuit board after oxidation treatment are pressed into a multilayer board

06.Drilling

Drill through holes, plug-in holes and tool holes for line connections between layers on the circuit board

07.Immersion Copper

Metallize the non-conductor part on the hole wall to facilitate subsequent copper electroplating

08.Outer dry film

Make the outer layer to connect the inner and outer layers completely

09.Graphic plating

Add the copper thickness of the non-film part to the thickness required by the customer

10.Outer layer fading, etching and tin

Manufacture the circuit designed by the customer

11.Outer inspection

Detect whether the circuit board has open circuit or short circuit defects, and pick out defective products

12.Solder mask

Prevent the solder overflow from causing short circuits, prevent non-soldering points from being contaminated with solder, and effectively protect the circuit board from moisture

13.Text

Facilitate maintenance and identification

14.Surface treatment

Protect the copper surface and provide favorable conditions for the subsequent process

15.Forming

Through die stamping or CNC gong machine gong the shape required by the customer

16.Test

Ensure that the shipped products will not have functional problems

17.Final inspection

Ensure the quality of shipping circuit boards

18. Package

Prevent the circuit board from getting damp and affect the welding effect

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