Process Capacity

/Process Capacity
Process Capacity2021-08-11T06:20:05+00:00

Process Capacity

Items

Mass production capabilities

Prototyping capabilities

Layers
1-20
1-28
Base materals
FR-4, High-frequency
Maximum size
500mm×
600mm
580mm×
800mm
Dimension accuracy
±0.13mm
±0.1mm
Thickness range
0.20-4.00mm
0.20-6.00mm
Thickness tolerance
(THK<0.8mm)
±10%
±10%
Dielectric thickness
0.07-3.20mm
0.07-5.00mm
Minimum line width
0.1mm
0.075mm
Minimum space
0.1mm
0.075mm
Outer copper thickness
37-175um
35-280um
Inner copper thickness
17-175um
17-280um
Drill hole
(Mechanical)
0.15-6.35mm
0.15-6.35mm
Finished hole
(Mechanical)
0.10-6.30mm
0.10-6.30mm
Diameter tolerance
(Mechanical)
±0.075mm
±0.075mm
Hole position tolerance
(Mechanical)
±0.05mm
±0.05mm
Aspect ratio
10:01
13:01
Solder mask type
LPI
LPI
Minimum solder mask bridge width
0.1mm
0.08mm
Minimum solder mask clearance
0.075mm
0.05mm
Plug hole diameter
0.25-0.50mm
0.25-0.60mm
Impedance control tolerance
±10%
±10%
Surface finish
HASL, LF-HASL, ENIG, Imm Tin, Imm Ag, OSP, Gold Finger